Legacy to Advanced Packaging Technical and Strategic Support
Consulting:
Knowledge areas:
- Technical Program Management
- Package Requirements Assessment and Selection
- Conceptual and Detailed Design
- Assembly supplier search and communication
- Technical assistance and trouble-shooting
- Advanced Packaging Technology Road-Mapping
Knowledge areas:
- Wire-bond, Flip-Chip, Stacked-Device Packaging
- 3-Dimensional (3D) Packaging, Thru-Silicon-Via (TSV)
- 2.5D and Multi-Chip Packaging, Substrates, Modules (MCM)
- Wafer-Level Packaging and Processing
- Package and Module Miniaturization
- LGA, BGA, QFN, Chip-Scale-Packaging (CSP)
- Legacy package support – SOIC, TSOP, etc
- Printed-Circuit-Board (PCB) Design, Fabrication, and Assembly
- Commercial, Industrial, and Medical Applications
- Package Development Engineering and IP Capture