In addition to inhouse expertise, Olimar-Tech is networked with a variety of domestic and international assembly operations.  Assistance is available for a wide array of needs, from package design work, to identifying a suitable assembly supplier, to  providing supplemental Engineering or Technical Liaison support for an existing assembly service engagement. 

​Our consultants are experienced with the Multi-Phase process required for Semiconductor Package and PCB Development and Qualification, including: 
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Conceptual Design:

• Assess technical requirements
• Generate performance specifications
• Preliminary package selection and design
• Feasibility analysis and simulation screening

 
Detailed Design:

• Package type selection and pinout
• Multi-Layer substrate layout
• Electrical, Thermal, Mechanical, and Thermo-Mechanical (FEA/CFD) simulation
• Package and hardware specifications

 
Package Prototyping:

• Direct and In-direct material set finalization
• Assembly process development
• Prototype assembly and test
• Reliability testing and evaluation
• Failure analysis and corrective action

Package Production:

• Substrate fabrication (organic, flex, ceramic)
• Factory screening and selection
• Volume assembly tooling, equipment
• Process optimization, yield enhancement
• Package qualification testing
• Technical trouble-shooting
• Technology transfer and training
• Customer-factory liaison
• Manufacturing cost reduction 

Printed-Circuit-Board (PCB):

• Mechanical design and routing layout
• Simple to Complex Multi-Layer boards
• Advantageous pricing and lead-times

Package and PCB Design and Schematics

Component Prototyping and Manufacturing

Assembly Process and Equipment Selection

Package and PCB Multi-Layer Layout

PCB Fabrication and Assembly

Component Qualification and Test

technical support

ip support

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